A long time, notebook because the strictures of the fuselage, at a time when the design has to consider the question of the heat sink. As notebook computer performance fast improve, its internal CPU, and GPU run frequency increasingly fast, corresponding by produced of heat also on increasingly large, how let notebook in small of space within, quickly to internal heat disseminated out, not only is notebook design production manufacturers must to resolved of problem, while, upgrade chip schema, improve energy efficiency and reduced chip calorific value, extended notebook life time, is Intel, and AMD, upstream chip manufacturers of task. Next, we'll take a look at portable design used in cooling technology.
Symptoms for the disease itself: the new Sandy Bridge Framework more conducive to enhance heat dissipation
Thermal comfort of a direct impact on the user's experience, second generation of Intel Core Duo Sandy Bridge architecture intelligent boost 3D gaming performance, HD encoding, decoding performance, is a further milestone for Intel. Using second generation 32nm process technology, the new structure of these second generation high-k metal gate (HKMG) technology manufacturing, advanced technology brings energy efficiency, and reduce heat.
At the same time, second generation core processor with wisdom, according to the different run types dynamically adjust the frequency of the CPU and the GPU, achieve the maximum performance or energy consumption, and join the new power balance algorithm to manage power consumption and heat dissipation and optimal performance. Due to the introduction of a new generation of power-balancing algorithms, new algorithms allow between processor core and the core video cards to have dynamic equilibrium, when detects CPU performance or operation of the system requirements for more powerful graphics performance, TDP resources will be inclined to it for the time being, to this in the heating and power consumption allowed within the scope of providing greater headroom, achieve the best balance of performance requirements and heat sink.
Processor AMD APU series: thermal lift, life advantages
In AMD, including AMD E/C in the early series of ultra low-power processor, AMD processor implemented in recent years APU a series now, using 32nm process manufacturing process and internal code for Llano, a total of three series, number of core quad-core and dual-core, power is divided into and 35W (35W suffix M,45W suffix MX), mainly for laptop and desktop markets. As a result of the new framework, so thermal advantage of lift, battery life is also very obvious.
Regardless of in moved Office, and HD audio play, and 3D game battery life test in the, APU power control and performance performance are appeared out amazing of charm, especially APU accelerated processor of low power run and double graphics switch mode, better of balance has performance and life Zhijian of balance, while in does not sacrifice strong graphics performance of situation Xia, to meet user more of moved Office and audio entertainment using demand, implementation has more long of battery life time, and brings more excellent of fever control.
Cooling solution: tube active cooling fans, keyboards, shell auxiliary cooling
Heat pipe + fan, is a portable basic heat, the biggest advantage of heat pipes fast on a chip pass heat to the heat sink, and then by fans venting heat forced. Only some of the special structure of passive (no fan) products, at present almost all notebooks have adopted this style of active cooling heat sink. And notebook cooling fan with automatic intelligent speed control, depending on the CPU and GPU temperature, or the heat sink temperature and automatically adjust the fan speed to reduce noise effect.
Because of the high calorific value of the CPU and the GPU, so designing better notebooks are usually dual heat pipes, and even three-tube design, you can more quickly on a chip pass heat to the heat sink, and then by fans venting heat forced to effectively reduce internal heat accumulation of the fuselage, improving user hand touch comfort.
By four weeks, opening at the bottom of the cooling vents on the back of the machine, through the cold and hot air flow, remove body heat. At the same time, and cooling vents thermal compatible laptops inside or with special air duct flow design, using heat sink holes and internal structure to create better air circulation, to enhance heat dissipation.
Auxiliary cooling: keyboards, shell is also a thermal window
As the keyboard area occupies most of notebook c area, and area below the keyboard is the fever's largest motherboard, laptop keyboards are in operation with varying degrees of heat. Use bottom boards can also be the keyboard to generate passive conduction of heat, or some thin and light notebook keyboard convection heat sink thermal, tapping the keyboard bounce, complete cold air inflow discharge hot air through the key hole, reached a certain level of cooling. Heat sink while the keyboard fully utilizing resource of the fuselage, but too high a temperature touch, can also affect the user comfort. So they usually left keyboard operation area (left hand) temperature is slightly lower, right (right hand) slightly higher temperatures.
Since notebook internal narrow, so also auxiliary cooling notebook engineers using the shell. In addition to the common appearance of ABS engineering plastic, metal-looking models, the use of metal stronger than plastic thermal conductivity away from, well the auxiliary cooling, because metal fuselage shell has become the largest radiator.
Manufacturer's dedicated solution: ASUS laptop icecool, HP laptop CoolSense, Toshiba laptop airflow cooling technology
Compared with conventional thermal solutions, some notebook manufacturers also developed unique thermal solution, such as ASUS icecool airflow cooling technology, HP CoolSense, Toshiba, and other heat dissipation technology, also in favour of the notebook thermal improvements, more comfortable operation.
ASUS exclusive IceCool cool cooler cooling technology/ASUS Laptop batteries.
Long time using notebook, especially keyboard operation area accumulation of heat will on user of using caused plagued, for this Asus launched of IceCool design, can reduced hot resistance, and improve thermal conductivity coefficient, and optimization radiator deployment of forms, implementation notebook heat of transfer, and dispersed, eventually may implementation notebook wrist supporting part of temperature below human standard temperature 25%, can implementation notebook work Shi, palm rest area always maintained in most suitable human contact of 25 ℃-28 ℃ Zhijian. Users can be outside the experience of most inside the cool, even long meetings and everyday computing, entertainment applications and do not have to worry about machine heat damage or degradation issues.
ASUS exclusive IceCool cool cooler cooling technology, creating cool experience for the users anytime, anywhere. This stems from an ASUS motherboard design skill more than 20 years of cooling solutions, through original design optimization and matching thermal modules, rapid heat cool, order books the easy wrist support parts of the heating temperature lower than the average human body temperature. Allow users even in the heat of the environment in the long run large applications such as 3D games, don't worry machines due to overheating due to poor running, guaranteeing complete machine stability while running, you can also allow your hands to enjoy more cool.
HP original/HP CoolSense intelligent thermal technology / HP Laptop Batteries.
HP coolsense intelligent thermal technology, optimize the design layout notebook internal heating parts, high calorific value of components such as graphics design position in the rear of the fuselage, makes the heat dissipation of more focus, away from users frequently touch on the keyboard and wrist support section. At the same time to optimize the air flow design, facilitates quick venting heat the body, but also through HP's simple Coolsense software for intelligent induction heat, set usage patterns.
Toshiba air cooling technology: application to the latest "super" Toshiba laptop batteries.
Airflow cooling technology, was Toshiba and Intel jointly develop new cooling technology, special based on the Intel Core Duo processor research and development of light-weight laptop, airflow cooling technology enables Toshiba to the latest Intel Core Duo CPU integrated into the slim fuselage, and maintaining high performance of the product.
Auxiliary cooling tools: heat sink base, cooling pad for common
Since most notebook in use after a period of time will still have the feeling of surface temperature rise, give users a disturbing sense of hot keyboard palmrest area, inside and outside temperature is too high to defuse notebook, upgrade the quality of use and extend the life of notebooks, also has a variety of portable auxiliary cooling tools on the market, such as common notebook cooling base, two kinds of notebook cooling pad. Notebook Cooling base cooling fan to increase air flow at the bottom of your notebook, so that the bottom of the notebook have been uniform heat dissipation, resulting in lower internal temperatures are effectively reducing the temperature of the laptop accessibility.
Summary: upstream, from Intel or AMD chip manufacturers and notebook manufacturers such as ASUS, HP, design or packaging of the heat dissipation technology in integration in portable products, users are also more sensitive to the actual feel of the product. In addition to the concerns of our Pacific notebook channel test articles, laptop stores feel the fever of prototype, is also a quick way to judge notebook cooling. Due to high-end notebook processor, and independent graphics of large configuration using, notebook internal fever also fast improve, in notebook using process in the, should as far as possible maintained notebook using environment of ventilation, maintained thermal mouth around open, out outlet around don't has block property, using notebook thermal base, secondary thermal; if has ability and conditions, needs itself or sent sales Hou cleanup notebook internal, and especially thermal tablets and thermal fan accumulation of dust; also has a small prompted, Small power adapter long running major heating, power adapter should be as far as possible away from the laptop and the human body, the effect is good.
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